ASI MP 5404FS Rapid Heat Cure One Part Epoxy Choose Size:12 Ounce Cartridge 000 cps 2700/4200 -65 to+200°

000 cps 2700/4200 -65 to+200° F <7

3M DP110 Translucent is a two-part

Power Adhesives Tecbond 420 is a polyolefin-based adhesive engineered for use with spray applicators to provide consistent coverage across large surface areas

Sulzer MS 06-48 Static Mixer

Rigid Bonds: Cures to a rigid state for high static load holding

ASI MP 5404FS Rapid Heat Cure One Part Epoxy Choose Size:12 Ounce Cartridge 000 cps 2700/4200 -65 to+200°About the ASI MP 5404FS Fast Setting Heat Cure Epoxy The Adhesive Systems Inc (ASI) MP5404FS is a single component heat cure epoxy. What makes the MP5404FS unique is that it will cure in under 20 seconds when exposed to heat via an induction or infrared oven. This fast setting epoxy adhesive will bond most substrates including difficult surfaces like ceramic, metal and glass. The MP5404FS is a non sag epoxy and will hold up to water, humidity and most